參數(shù)資料
型號: PM5372-BI
英文描述: Telecommunication IC
中文描述: 通信集成電路
文件頁數(shù): 167/169頁
文件大?。?/td> 989K
代理商: PM5372-BI
TSE Transmission Switch Element Datasheet
Released
Proprietary and Confidential to PMC-Sierra, Inc., and for its Customers’ Internal Use
Document ID: PMC-1991258, Issue 7
167
20 Thermal Information
This product is designed to operate over a wide temperature range when used with a heat
sink and is suited for outside plant equipment
1
.
Table 28 Outside Plant Thermal Information
Maximum long-term operating junction temperature (T
J
) to ensure adequate long-
term life.
105 °C
Maximum junction temperature (T
J
) for short-term excursions with guaranteed
continued functional performance
2
. This condition will typically be reached when the
local ambient temperature reaches 85 °C.
125 °C
Minimum ambient temperature (T
A
)
-40 °C
Table 29 Device Compact Model
3
JC
0.1 °C/W
JB
4.0 °C/W
Table 30 Heat Sink Requirements
SA
+
CS
4
[(105-70)/P]-
JC
°C/W
5
SA
and
CS
are required for long-term operation
JB
JC
Board
Device
Compact
Model
CS
SA
Junction
Case
Heat Sink
Ambient
Operating power is dissipated in the package at the worst-case power supply. Power
depends upon the operating mode. Please refer to ‘High’ power values in section
15.1Power Requirements.
Notes
1. The minimum ambient temperature requirement for Outside Plant Equipment meets the minimum
ambient temperature requirement for Industrial Equipment
2. Short-term is used as defined in Telcordia Technologies Generic Requirements GR-63-Core Core.
3. junction-to-case thermal resistance, is a measured nominal value plus two sigma.
JB
, the junction-to-
board thermal resistance, is obtained by simulating conditions described in JEDEC Standard JESD 51-
8.
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