19-4750; Rev1; 7/11 27 of 194 9 FUNCTIONAL DESCRIPTION This section provides a high level, functional view of th" />
參數(shù)資料
型號: DS34S132GN+
廠商: Maxim Integrated Products
文件頁數(shù): 115/194頁
文件大?。?/td> 0K
描述: IC TDM OVER PACKET 676-BGA
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 40
功能: TDM-over-Packet(TDMoP)
接口: TDMoP
電路數(shù): 1
電源電壓: 1.8V, 3.3V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 676-BGA
供應(yīng)商設(shè)備封裝: 676-PBGA(27x27)
包裝: 管件
其它名稱: 90-34S13+2N0
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁當(dāng)前第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁第137頁第138頁第139頁第140頁第141頁第142頁第143頁第144頁第145頁第146頁第147頁第148頁第149頁第150頁第151頁第152頁第153頁第154頁第155頁第156頁第157頁第158頁第159頁第160頁第161頁第162頁第163頁第164頁第165頁第166頁第167頁第168頁第169頁第170頁第171頁第172頁第173頁第174頁第175頁第176頁第177頁第178頁第179頁第180頁第181頁第182頁第183頁第184頁第185頁第186頁第187頁第188頁第189頁第190頁第191頁第192頁第193頁第194頁
DS34S132 DATA SHEET
19-4750; Rev1; 7/11
27 of 194
9
FUNCTIONAL DESCRIPTION
This section provides a high level, functional view of the S132. Because of the high level of integration and
complexity that has been included in the S132, it is necessary to first explain the terminology and conventions that
are used. This Functional Description section is further supported by the Register Guide section, which identifies
common settings for specific applications, and the Register Definition section which provides a definition for each
register, but without as much regard for application information.
The industry term “Pseudowire” (PW) includes the idea of a “virtual connection” (pseudo virtual; wire
connection). PW data is carried in packets. The connection is not a “hardwired” connection but “virtual” in nature
where the “virtual connection” is recognized by interpreting the PW packet header (e.g. the PW-ID provides the PW
destination address).
There are multiple PW protocols to carry different types of data. Each is designed to support a particular service
type, for example PCM, HDLC, ATM and Frame Relay. The PW protocols enable a Service Provider to transport
and switch all of its services using a single unified switching/routing/forwarding technique (e.g. IPv4).
Enterprise and CPE equipment can similarly use the PW protocols. PWs can enable LAN
switching/routing/forwarding using a single protocol/equipment type (e.g. Ethernet switch) to support both packet
encapsulated-TDM and bursty packet data. PWs can also be used to enable the use of a single WAN interface to
carry aggregated Enterprise data across the WAN/PSN. For example, if the WAN service/interface is Ethernet, then
a single WAN-Ethernet interface can be used to carry “bursty” Ethernet data and packet encapsulated TDM data
across the WAN. This prevents the need to pay for independent Ethernet WAN and TDM WAN services.
The DS34S132 supports three PW types. The term “TDMoP PW” is used to refer to a PW that is used to transport
a constant-bit-rate TDM service. The S132 supports two types of TDMoP PWs: SAToP (SAT) and CESoPSN
(CES). The term “HDLC PW” is used to refer to a PW that is used to transport the non-idle payload data from an
HDLC data stream. The S132 includes the necessary functions to translate TDM constant bit rate data streams
to/from TDMoP PWs and HDLC data streams to/from HDLC PWs for PSNs using the UDP/IP, L2TPv3/IP, MEF-8
or MFA-8 protocol.
PWs that are recognized by the S132 are described using the terms “Connection”, ”Packet”, “Bundle” and “Bundle
ID” (BID). Each term emphasizes a different aspect of the PW. The S132 supports up to 256 programmed Bundles
(numbered Bundle 0 through Bundle 255). The term “Bundle” emphasizes the recognized/programmed parameters
associated with a PW (the programmed header format, payload format, PW-ID value, etc.). If a PW packet is
received by an S132, but the packet format or PW-ID of the packet does not equal that of a programmed Bundle,
then the packet is not recognized. The term “BID” equates to a “recognized/programmed PW-ID” (part of a Bundle).
The term “Connection” emphasizes the type of data carried by a packet (e.g. timing) and emphasizes where the
data is forwarded inside the S132 (e.g. to a Clock Recovery Engine). The S132 Bundle Connection types include
SAT/CES Payload, HDLC Payload, SAT/CES PW-Timing and CPU. SAT, CES and HDLC Payload Connections
are used to forward the data between a TDM Port and the payload of a TDMoP PW. A SAT or CES PW-Timing
Connection is used to forward the timing information between a TDM Port and the TDMoP PW. A CPU Connection
is used to forward packets between the CPU and the Ethernet Port. CPU packets can be PW packets or non-PW
packets. A “connection” is commonly “established” by enabling an internal S132 function. For example enabling the
Clock Recovery Engine for a particular Bundle “establishes” a PW-Timing Connection for that Bundle.
The term “Bundle” can be thought of as a “small set of connections and parameters”. The packets for a Bundle can
contain data/information for multiple connections, e.g. the packet for a SAT Bundle can contain data/information for
a SAT Payload Connection and a SAT PW-Timing Connection.
The S132 supports a number of CPU packet types that are not Bundle/PWs. The term “CPU Connection” indicates
that the data stream carries data that is forwarded to the CPU. The S132 supports specialized header field values
and conditions that identify CPU Connections (e.g. the MEF OAM header).
The terms “OAM Bundle” and “OAM BID” are similar in meaning to “Bundle” and “BID” except that they are only
used for CPU Connections. The S132 supports up to 32 “OAM Bundles” that are programmed independent of the
256 Bundles. “OAM Bundles” are used to support Out-band VCCV (also known as UDP-specific OAM).
The term “Packet”, when used in combination with one of the Connection/data types emphasizes that the packet
contains data/information for a particular type of connection (e.g. CES, SAT, HDLC, PW-Timing and/or CPU
Packet). The terms “packet” and “frame” are loosely used interchangeably to identify a “datagram/unit” of data that
相關(guān)PDF資料
PDF描述
DS34T102GN+ IC TDM OVER PACKET 484TEBGA
DS3501U+H IC POT NV 128POS HV 10-USOP
DS3502U+ IC POT DGTL NV 128TAP 10-MSOP
DS3503U+ IC POT DGTL NV 128TAP 10-MSOP
DS3897MX IC TXRX BTL TRAPEZIODAL 20-SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS34S132GN+ 功能描述:通信集成電路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube
DS34S132GNA2+ 功能描述:通信集成電路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube
DS34T101 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip
DS34T101_08 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip
DS34T101_09 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip