- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄1916 > DS34S132GN+ (Maxim Integrated Products)IC TDM OVER PACKET 676-BGA PDF資料下載
參數(shù)資料
| 型號(hào)： | DS34S132GN+ |
| 廠商： | Maxim Integrated Products |
| 文件頁(yè)數(shù)： | 132/194頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC TDM OVER PACKET 676-BGA |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 功能： | TDM-over-Packet（TDMoP） |
| 接口： | TDMoP |
| 電路數(shù)： | 1 |
| 電源電壓： | 1.8V, 3.3V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 676-BGA |
| 供應(yīng)商設(shè)備封裝： | 676-PBGA（27x27） |
| 包裝： | 管件 |
| 其它名稱： | 90-34S13+2N0 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)當(dāng)前第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)第179頁(yè)第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)第186頁(yè)第187頁(yè)第188頁(yè)第189頁(yè)第190頁(yè)第191頁(yè)第192頁(yè)第193頁(yè)第194頁(yè)
DS34S132 DATA SHEET
19-4750; Rev 1; 07/11
42 of 194
Table 9-5. CAS Translation using RDAT and TDAT
TXP Direction
RXP Direction
SCTXDFSE to
PRCR1.MFS
TDM Port RDAT
TXP Packet Out
RXP Packet In
TDM Port TDAT
PTCR1.MFS
Format
Frm 1-12
Frm 13-24
Frm 1-12
Frm 13-24
Format
ESF to SF A1B1C1D1
A1B1A1B1
A1B1
SF
SF to ESF A1B1
A2B2
A1B1CD
ESF
SF to SF
A1B1
A2B2
A1B1A2B2
A1B1
A2B2
SF
ESF to ESF A1B1C1D1
A1B1C1D1
ESF
E1 to E1
A1B1C1D1
E1
Special considerations:
Each system should be analyzed to determine whether the 2-bit to 4-bit translation function is appropriate. The
method of appending a fixed, programmed “CD” value in one direction (SF to ESF) and discarding the “CD” bits in
the other direction (ESF to SF) may not be valid.
In applications where T1-SF CAS Signaling is carried in RXP packets, because the S132 stores 24 frames of T1-
SF CAS Signaling, it is possible (during a loss of RXP packet condition) that a constantly alternating 2-bit CAS code
(A1B1 ≠ A2B2) is transmitted at the TDM Port if the last 2 received AB CAS-codes are 2 different values, the Jitter
Buffer underruns (e.g. RXP packet fault) and the CAS “Last Value” function is enabled (B.BCDR1.SCRXBCSS).
This can occur, for example, if the far end of the PW transmitted an On-hook to Off-hook CAS Code transition in the
last received RXP packet. If this condition occurs (A1B1 ≠ A2B2), the TDM Port transmitted CAS codes will alternate
between these two values every 12 frames. Each system should be evaluated to determine whether this condition
is acceptable (an external T1 Framer with CAS debounce function should filter out the alternating pattern).
The support of CAS Signaling in a system that allows the use of multiple Nx64 PWs with a single T1/E1 may
require the system to be compliant with the defect and alarm requirements of a Digital Cross-Connect. When a
T1/E1 is divided into multiple segment/paths, the segments are unable to use the T1/E1 framing as an indication of
the state of the connection. For example if 2 PWs are merged into a single T1/E1, a far end T1/E1 fault in the RXP
direction of PW #1 (e.g. LOS) cannot be directly communicated over the local, T1/E1 transmit port since that would
imply that PW #2 is experiencing the same fault (i.e. the local T1/E1 transmit Port cannot forward the T1/E1-AIS,
Alarm Indication Signal, for PW #1 without indicating the same for PW #2; some systems allow DS0-AIS). Each
system should be analyzed to determine whether Digital Cross-Connect defect and alarm conditioning is required.
If these functions are required, they should be implemented external to the S132 (e.g. in the T1/E1 Framer).
9.2.4.2 TSA Block Loopbacks
The TSA Timeslots can be programmed to loopback data using a Bundle Loopback, TDM Port Line Loopback or
TDM Port Timeslot Loopback (see Figure 9-13). Any number of Timeslots, Bundles and/or TDM Ports can be in
Loopback at the same time.
The Bundle Loopback sends packet payload data that has been received for an RXP Bundle back toward the
Ethernet Port in TXP packets for the same Bundle. When the Bundle Loopback is enabled (Pn.PTCR3.RXTXTSL),
the RXP packet payload data is processed as though it will be transmitted at a TDM Port. But when the payload
data reaches the TSA block the data is looped back in the TXP direction and processed as though the data was
received from the TDM port. To work properly all Timeslots associated with the Bundle should be programmed into
the Bundle Loopback state.
The TDM Port Line Loopback and TDM Port Timeslot Loopback send payload data from the receive TDM Port back
toward the transmit TDM Port without any packet processing functions. The TDM Port Timeslot Loopback
(Pn.PTCR3.PRPTTSL) allows loopback selection on a per-Timeslot basis while the TDM Port Line Loopback
(Pn.PTCR2.PRPTLL) provides a loopback of all Receive TDM Port Data.
9.2.5 TDM Port Data Processing Engines
A TDM Port is assigned to a Bundle using B.BCDR4.PNS. The format of the TDM Port data streams can be
Unstructured, Structured T1/E1 without CAS or Structured T1/E1 with CAS and are processed using 3 engine
types: HDLC, SAT/CES and Clock Recovery. The combination of B.BCDR1.PMT (Payload Engine Type),
B.BCDR3.TXBTS (TXP Bundle Structure), B.BCDR4.RXBTS (RXP Bundle Structure) and B.BCDR4.PCRE (Clock
Recovery Enable) select the payload format and engine type for each Bundle. Enabling a particular Engine Type for
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DS34T102GN+ | IC TDM OVER PACKET 484TEBGA |
| DS3501U+H | IC POT NV 128POS HV 10-USOP |
| DS3502U+ | IC POT DGTL NV 128TAP 10-MSOP |
| DS3503U+ | IC POT DGTL NV 128TAP 10-MSOP |
| DS3897MX | IC TXRX BTL TRAPEZIODAL 20-SOIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DS34S132GN+ | 功能描述:通信集成電路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube |
| DS34S132GNA2+ | 功能描述:通信集成電路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube |
| DS34T101 | 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip |
| DS34T101_08 | 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip |
| DS34T101_09 | 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。