參數(shù)資料
型號: TE28F800C3TD70
廠商: INTEL CORP
元件分類: PROM
英文描述: 512K X 16 FLASH 3V PROM, 70 ns, PDSO48
封裝: 12 X 20 MM, TSOP-48
文件頁數(shù): 1/72頁
文件大?。?/td> 1083K
代理商: TE28F800C3TD70
Order Number: 290645, Revision: 023
May 2005
Intel Advanced+ Boot Block Flash
Memory (C3)
28F800C3, 28F160C3, 28F320C3 (x16)
Datasheet
Product Features
The Intel Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest
0.13
m and 0.18 m technologies, represents a feature-rich solution for low-power
applications. The C3 device incorporates low-voltage capability (3 V read, program, and erase)
with high-speed, low-power operation. Flexible block locking allows any block to be
independently locked or unlocked. Add to this the Intel
Flash Data Integrator (Intel FDI)
software and you have a cost-effective, flexible, monolithic code plus data storage solution.
Intel Advanced+ Boot Block Flash Memory (C3) products are available in 48-lead TSOP, 48-
ball CSP, and 64-ball Easy BGA packages. Additional information on this product family can be
obtained from the Intel
Flexible SmartVoltage Technology
— 2.7 V– 3.6 V read/program/erase
— 12 V for fast production programming
1.65 V to 2.5 V or 2.7 V to 3.6 V I/O
Option
— Reduces overall system power
High Performance
— 2.7 V– 3.6 V: 70 ns max access time
Optimized Architecture for Code Plus
Data Storage
— Eight 4 Kword blocks, top or bottom
parameter boot
— Up to 127 x 32 Kword blocks
— Fast program suspend capability
— Fast erase suspend capability
Flexible Block Locking
— Lock/unlock any block
— Full protection on power-up
— Write Protect (WP#) pin for hardware
block protection
Low Power Consumption
— 9 mA typical read
— 7 uA typical standby with Automatic
Power Savings feature
Extended Temperature Operation
— -40 °C to +85 °C
128-bit Protection Register
— 64 bit unique device identifier
— 64 bit user programmable OTP cells
Extended Cycling Capability
— Minimum 100,000 block erase cycles
Software
— Supported by Intel’s Advanced Flash
File Managers -- Intel
VFM, Intel
FDI, etc.
— Code and data storage in the same
memory device
— Robust Power Loss Recovery for Data
Loss Prevention
— Common Flash Interface
http://www.intel.com/go/flashsw
Standard Surface Mount Packaging
— 48-Ball
BGA*/VFBGA
— 64-Ball Easy BGA packages
— 48-TSOP package
ETOX VIII (0.13
m) Flash
Technology
— 8, 16, 32 Mbit
ETOX VII (0.18
m) Flash Technology
— 16, 32 Mbit
ETOX VI (0.25
m) Flash Technology
— 8, 16 and 32 Mbit
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