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參數(shù)資料
| 型號(hào)： | KU386 |
| 廠商： | Intel Corp. |
| 英文描述： | SX MICROPROCESSOR |
| 中文描述： | SX微處理器 |
| 文件頁數(shù)： | 64/102頁 |
| 文件大小： | 1268K |
| 代理商： | KU386 |
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Intel386
TM
SX MICROPROCESSOR
Software Testing for Coprocessor Presence
When software is used to test for coprocessor
(Intel387 SX) presence, it should use only the follow-
ing coprocessor opcodes: FINIT, FNINIT, FSTCW
mem, FSTSW mem and FSTSW AX. To use other
coprocessor opcodes when a coprocessor is known
to be not present, first set EM
e
1 in the Intel386 SX
CPU’s CR0 register.
6.0 PACKAGE THERMAL
SPECIFICATIONS
The Intel386 SX Microprocessor is specified for op-
eration when case temperature (T
c
) is within the
range of 0
§
C–100
§
C. The case temperature may be
measured in any environment, to determine whether
the Intel386 SX Microprocessor is within specified
operating range. The case temperature should be
measured at the center of the top surface opposite
the pins.
The ambient temperature (T
a
) is related to T
c
and
the thermal conductivity parameters
i
ja
and
i
jc
from
the following equations (eqn. 3 is derived by elimi-
nating the junction temperature (T
j
) between eqns.
1 and 2):
1) T
j
e
T
c
a
P
*
i
jc
2) T
a
e
T
j
b
P
*
i
ja
3) T
c
e
T
a
a
P
*[
i
ja
b
i
jc
]
Values for
i
ja
and
i
jc
are given in Table 6.1 for the
100 lead fine pitch.
i
ja
is given at various airflows.
The power (P) dissipated by the chip as heat is
Vcc
*
Icc. A guaranteed maximum safe T
a
can be cal-
culated from eqn. 3 by using the maximum safe T
c
of
100
§
C, along with the maximum power drawn by the
chip in the given design, and
i
jc
and
i
ja
values from
Table 6.1. (The
i
ja
value depends on the airflow,
measured at the top of the chip, provided by the
system ventilation.)
7.0 ELECTRICAL SPECIFICATIONS
The following sections describe recommended elec-
trical connections for the Intel386 SX Microproces-
sor, and its electrical specifications.
7.1 Power and Grounding
The Intel386 SX Microprocessor is implemented in
CHMOS IV technology and has modest power re-
quirements. However, its high clock frequency and
47 output buffers (address, data, control, and HLDA)
can cause power surges as multiple output buffers
drive new signal levels simultaneously. For clean on-
chip power distribution at high frequency, 14 Vcc
and 18 Vss pins separately feed functional units of
the Intel386 SX Microprocessor.
Power and ground connections must be made to all
external Vcc and Vss pins of the Intel386 SX Micro-
processor. On the circuit board, all Vcc pins should
be connected on a Vcc plane and all Vss pins
should be connected on a GND plane.
POWER DECOUPLING RECOMMENDATIONS
Liberal decoupling capacitors should be placed near
the Intel386 SX Microprocessor. The Intel386 SX Mi-
croprocessor driving its 24-bit address bus and
16-bit data bus at high frequencies can cause tran-
sient power surges, particularly when driving large
capacitive loads. Low inductance capacitors and in-
terconnects are recommended for best high fre-
quency electrical performance. Inductance can be
reduced by shortening circuit board traces between
the Intel386 SX Microprocessor and decoupling ca-
pacitors as much as possible.
Table 6.1. Thermal Resistances (
§
C/Watt)
i
jc
and
i
ja
.
i
ja
versus Airflow - ft/min (m/sec)
Package
i
jc
0
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.07)
(0)
100 Lead
Fine Pitch
7.5
34.5
29.5
25.5
22.5
21.5
21
64
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