參數(shù)資料
型號(hào): K4J52324KI-HC1A0
元件分類: DRAM
英文描述: 512M X 1 DDR DRAM, 0.2 ns, PBGA136
封裝: HALOGEN FREE AND ROHS COMPLIANT, FBGA-136
文件頁數(shù): 58/61頁
文件大?。?/td> 1364K
代理商: K4J52324KI-HC1A0
- 61 -
K4J52324KI
datasheet
GDDR3 SGRAM
Rev. 1.2
11. PACKAGE DIMENSIONS (FBGA)
A
B
C
D
E
F
H
J
K
L
M
N
P
R
G
T
V
8
7
6
543
21
9
10
11
12
10.00 ± 0.10
0.80
2.00
4.40
0.80 x 11 = 8.80
1
4.
0
0.
1
0
6.
4
0
0.
80
x
16
=
12
.80
A
B
# A1 INDEX MARK
(Datum B)
MOLDING AREA
Bottom
0.95
1.90
136-
0.45 Solder ball
0.2 M AB
(Post reflow 0.50
± 0.05)
10.00 ± 0.10
14
.00
±
0.
10
#A1
Top
(Datum A)
0.
80
0.
80
Unit: mm
0.1
0
M
A
X
0.35 ± 0.05
1.10 ± 0.10
相關(guān)PDF資料
PDF描述
K4M64163PK-BE900 4M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54
K507 2 ELEMENT, 2000 uH, GENERAL PURPOSE INDUCTOR
K001 2 ELEMENT, 2000 uH, GENERAL PURPOSE INDUCTOR
K004 2 ELEMENT, 500 uH, GENERAL PURPOSE INDUCTOR
K5A22NAU KEYPAD SWITCH, SPST, MOMENTARY, 0.1A, 50VDC, 2 N, SURFACE MOUNT-STRAIGHT
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
K4J52324QC 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mbit GDDR3 SDRAM
K4J52324QC-AC20000 制造商:Samsung Semiconductor 功能描述:GDDR3 SDRAM X32 BOC - Trays
K4J52324QC-BC14 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mbit GDDR3 SDRAM
K4J52324QC-BC14000 制造商:Samsung Semiconductor 功能描述:GDDR3 SDRAM X32 BOC LEAD PART 10W - Trays
K4J52324QC-BC16 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:512Mbit GDDR3 SDRAM